| Place of Origin: | Guangdong China |
|---|---|
| Brand Name: | OEM |
| Certification: | ISO9001/ISO14001 |
| Model Number: | Customized |
| Minimum Order Quantity: | 5pcs |
| Price: | negotiable |
| Packaging Details: | 25 sets in Vacuum bag/ Carton |
| Delivery Time: | 10-14 wds |
| Payment Terms: | T/T |
| Supply Ability: | 10000pcs per month |
| Material: | FR-4 | Layers: | 2-48 Layers |
|---|---|---|---|
| Max Size: | 610X915mm | Min Via: | 0.1mm |
| Surface Treatment: | Immersion Gold,ENIG,OSP | Board Thickness: | 0.15-4.5mm |
| Outer Layer Copper Thickness: | 1oz-2oz | Min. Hole Size: | 0.1mm |
| Min. Line Width: | 3mil | Application: | Electronics Device,Consumer Electronics |
| High Light: | pcb hdi,hdi printed circuit boards |
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Shenzhen Manufacturer Multi-Layer HDI PCB BGA Printed Circuit Board
1. Product Descprition
| Item | Specification |
| Material | High TG FR4 |
| Layers | 4-20 layers |
| HDI | HDI plus 1 or 2 |
| Copper thickness | 1/3-12OZ |
| Minimum Via | 0.1mm |
| Surface treatment | ENIG,OSP |
| Board thickness | 0.15-4.5mm |
| Solder mask color | Gree,Blue,Black,Red,White |
| Tolerance of board thickness | T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm |
2.HDI capablity and example
1) X+X process
( Layer Drawing) (Cross section)
2) 1-N-1 process
( Layer Drawing) (Cross section)
3)2-N-2 process-B
( Layer Drawing) (Cross section)
4)2-N-2 process-N(Advanced:6+N+6)
( Layer Drawing) (Cross section)
3. Application
1)Communication electronic equipment:Smartphone,Multifunctional Phone,visual telephone
2)Computer:Laptop, Super computer, Pad.
3) Consumer Electronics: Camera, Digital TV, Video
4) Car
5) Equipments
6) Space and aviation: satellite,guided missile
7) Medical Appliances
8) Industral Control
4.Package
