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Cree led aluminium al clad pcb printed circuit electronic boards manufacturing

Basic Information
Place of Origin: Shenzhen,China
Brand Name: Customized
Certification: ISO9001/ISO14001/CE/RoHs
Model Number: Customized
Minimum Order Quantity: 1 piece
Price: negotiable
Packaging Details: none
Delivery Time: 1-7 days
Payment Terms: T/T
Supply Ability: 100000 pin per month
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Detail Information
Base Material: Aluminium Surface Finishing: Immersion Gold/sliver/tin,OSP,HASL
Copper Thickness: 1oz Min.Line Width: 3mils
Min.Line Space: 3mils Min.hole Size: 0.1mm
Application: Led Light

Product Description

Cree led aluminium al clad pcb printed circuit electronic boards manufacturing

Aluminum PCB Clad can be advantageous to use for their ability to integrate a dielectric polymer layer with a high thermal conductivity for a lower thermal resistance.

Metal core PCBs transfer heat 8 to 9 times faster than FR4 PCBs. Al PCB laminates dissipate heat, keeping heat generating components cooler which results in increased performance and life.

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As soon as we receive your documents, our business will contact you within 1 hour.
 
Item Technical Specification
Number of Layers 2-60 layers
Laminate

CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial

Kapton, PI, PET for flex.

Laminate Brand KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,Arlon,Taconic,Ventec and customer specify
Maximum board size

610X1

060mm

Board thickness 0.15-4.5mm
Minimum line width 4mils (1oz Cu finished)
Minimum Line gap 4mils(1oz Cu finished)
Outer layer copper thickness 1/3-12OZ
Inner layer copper thickness 1/3-14OZ
Min. finished hole size (Mechanical) 0.20mm
Min. finished hole size (laser hole) 0.075mm
Aspect ratio 10:01
Solder Mask Types and brand Nanya,Taiyo
Solder Mask Color Gloss & matte green
Impedance Control Tolerance 10%
Surface Treatment HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
V-Cut V-cut degree 30+/-5 degree
Tol: +/-0.13mm
Chamfer The angle type of the chamfer 20,30, 45 Degree
Plug via hole Min. size can be plugged 0.15mm
Max. size can be plugged 0.50mm
Largest NPTH hole size 6.50mm
Largest PTH hole size 6.50mm
Min. annular ring can be kept 6mils
Min. distance between the IC pads can keep SM bridge 8mils
Min. SM bridge for green soldermask 4 mils
Min. SM bridge for black soldermask 5mils
Tolerance of outer dimension size Tol: +/-0.13mm
Tolerance of board thickness T>=1.0mm, Tol: +/-10%
T<1.0mm, Tol:+/-0.1mm
Tolerance of finished PTH hole size Tol: +/-0.075mm
Specila Progress Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance contro

Contact Details
Zheng

WhatsApp : 8615173250592